Systematic Analysis on The Development and Potential Use of Novel Semiconductors

Authors

  • Zichun Zhao

DOI:

https://doi.org/10.61173/rezbea60

Keywords:

Silicon, Gallium Nitride (GaN), Semiconductor Technology, High-Frequency Performance

Abstract

Silicon-based transistors and integrated circuits, crucial for modern technology, are facing limitations due to scaling constraints. As transistors shrink, their performance is capped, affecting advanced technologies like AI, IoT, and 5G. Gallium nitride (GaN), with a melting point 200°C higher than silicon, presents a promising alternative due to its superior high-power and high-frequency performance. This essay reviews silicon’s semiconductor limitations and highlights the advancements in silicon carbide and Gan. The basic theories, such as electron mobility, energy level and covalent bond, are analyzed, and it is found that GaN is better than Sic and Si, but the three examples of semiconductors have different development fields in different fields. It compares the benefits of traditional silicon with these novel semiconductors, focusing on high-frequency and high-temperature performance. The essay also discusses current development, issues, and future predictions in semiconductor technology. Exploring new materials like GaN and silicon carbide addresses the technical challenges of silicon and enhances device performance, broadening technological possibilities.

References

[1] Ding X, Zhou Y, Cheng J. A review of gallium nitride power device and its applications in motor drive. CES Transactions on Electrical Machines and Systems, 2019, 3(1): 54-64.

[2] Khan M A, Salah K. IoT security: Review, blockchain solutions, and open challenges. Future generation computer systems, 2018, 82: 395-411.

[3] Jia C, Yu T, Lu H, et al. Performance improvement of GaN- based LEDs with step stage InGaN/GaN strain relief layers in GaN-based blue LEDs. Optics express, 2013, 21(7): 8444-8449.

[4] Douix M, Baudot C, Marris-Morini D, et al. Low loss polysilicon for high performance capacitive silicon modulators. Optics Express, 2018, 26(5): 5983-5990.

[5] Huang Z H, Tang S W, Fan C T, et al. Dynamic on-resistance stability of SiC and GaN power devices during high-frequency (100–300 kHz) hard switching and zero voltage switching operations. Microelectronics Reliability, 2023, 145: 114983.

[6] Anderson C M, Mastrocinque C, Greenberg M W, et al. Synthesis, characterization, and photophysical properties of bismetalated platinum complexes with benzothiophene ligands. Journal of Organometallic Chemistry, 2019, 882: 10-17.

[7] Kim K, Park K, Jeon H W, et al. Design complexity based flexible order dispatching for additive manufacturing production. International Journal of Production Economics, 2024, 274: 109307.

[8] Lee J, Cook T E, Bryan E N, et al. Wafer bonding of silicon carbide and gallium nitride. MRS Online Proceedings Library, 2001, 681: 1-6.

[9] Roccaforte F, Giannazzo F, Greco G. Ion implantation dox in silicon carbide and gallium nitride electronic devices. Micro. MDPI, 2022, 2(1): 23-53.

[10] Wu J. The development and application of semiconductor materials. 2020 7th International Forum on Electrical Engineering and Automation (IFEEA). IEEE, 2020: 153-156.

[11] Song J. The history and trends of semiconductor materials’ development. Journal of Physics: Conference Series. IOP Publishing, 2023, 2608(1): 012019.

[12] Varley J B, Shen B, Higashiwaki M. Wide bandgap semiconductor materials and devices. Journal of Applied Physics, 2022, 131(23).

[13] Chabi S, Kadel K. Two-dimensional silicon carbide: emerging direct band gap semiconductor. Nanomaterials, 2020, 10(11): 2226.

[14] Matsunami H. Fundamental research on semiconductor SiC and its applications to power electronics. Proceedings of the Japan Academy, Series B, 2020, 96(7): 235-254.

[15] Musumeci S, Mandrile F, Barba V, et al. Low-voltage gan fets in motor control application; issues and advantages: A review. Energies, 2021, 14(19): 6378.

[16] Singh S, Chaudhary T, Khanna G. Recent advancements in wide band semiconductors (SiC and GaN) technology for future devices. Silicon, 2022, 14(11): 5793-5800.

[17] Udabe A, Baraia-Etxaburu I, Diez D G. Gallium nitride power devices: a state of the art review. IEEE Access, 2023, 11: 48628-48650.

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Published

2024-10-29