Chip Appearance Inspection Using Machine Learning Techniques
DOI:
https://doi.org/10.61173/96ajbn41Keywords:
YoloV5, system design, chip packaging, chip checkAbstract
In recent years, the increasing demand for chips has put forward higher requirements for chip production quality and production efficiency. After the chip manufacturing is completed before leaving the factory, it needs to be detected after packaging, which makes the development of chip detection and localization system difficult due to the small size and large number of chips and the high precision requirements for them. Therefore, this paper aims to design a fast, highprecision chip detection and positioning system for the positioning and detection needs of the chip packaging process, the chip detection and positioning system for in-depth research, to achieve the accurate positioning of the chip as well as the deformation produced by the detection of the main work is as follows: the first chapter is mainly about why this paper is mainly aimed at discovering the problems in the chip packaging process. The second chapter is about how to take pictures of the chip. Chapter 3 focuses on the pre-processing of the pictures. Chapter 4 focuses on determining whether the chip is deformed through different machine learning and deep learning techniques. Finally, the conclusion section summarizes the whole paper.
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