A Review of Physical Vapor Deposition of Two Dimensional Materials

Abstract

As the semiconductor industry demands higher chip integration, Moore’s Law is increasingly constrained by physical limits of chip miniaturization and quantum tunneling effects. Traditional semiconductor materials can no longer meet the performance requirements of next-generation electronic devices. Two-dimensional materials, with their atomic-level thickness and exceptional physicochemical properties, have emerged as a critical breakthrough for overcoming these challenges. Physical vapor deposition (PVD), a core technology for synthesizing two-dimensional materials, offers advantages such as controllable deposition processes, high-fidelity thin film purity, and excellent compatibility with existing semiconductor processes, making it essential for largescale production. This paper reviews common PVD methods, including thermal evaporation, electron beam evaporation, and sputtering (DC sputtering, RF sputtering, and magnetron sputtering), analyzes their pros and cons, and discusses innovations like contactless heating and pulse techniques. It also explores verified applications of PVD in cutting-edge research on two-dimensional materials such as graphene and TMDs. This review provides valuable references for optimizing PVD processes and improving equipment in two-dimensional material synthesis, while offering insights for future applications in semiconductor devices and optoelectronic detection.