Research on the innovation path of China's semiconductor industry in the post-Moore era

Abstract

In the post-Moore era, the global semiconductor industry faces problems such as the slowdown of Moore's Law, rising costs of advanced processes, and challenges in material and architecture innovation. China's semiconductor industry has gaps in technological innovation, supply chain security, and market competition, but the technological changes in the post-Moore era provide it with opportunities for innovative breakthroughs. This study systematically analyzes the development status, international competition landscape, technological challenges, and innovation paths of China's semiconductor industry. The study points out that China should increase R&D investment in advanced packaging, heterogeneous integration, new material applications, and new semiconductor architectures, and promote industry-university-research cooperation to build an independent and controllable industrial ecosystem. In the short term, China can focus on breakthroughs in GAA transistors and chiplet technology; in the medium term, focus on FD-SOI process and planar process optimization; in the long term, it needs to deploy three-dimensional integrated circuit technology and establish an all-round innovation system. The study provides theoretical support and practical paths for the innovative development of China's semiconductor industry in the post-Moore era.