LU, Yizhe. Research on System-level Design Challenges and Solutions for 3D Chiplet Integration. Science and Technology of Engineering, Chemistry and Environmental Protection, [S. l.], v. 4, n. 2, p. 15652, 2026. DOI: 10.61173/1xkw6249. Disponível em: https://stecep.deanfrancis.press/article/view/342. Acesso em: 4 nov. 2026.